Transcription of Highly Accelerated Thermal Shock (HATS ) Testing …
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Highly Accelerated Thermal Shock ( hats ) Testing for PCB. Hole reliability Bob Neves President Integrated reliability Test Systems, Inc. December 2003. Outline Acknowledgements History of Thermal Shock MIL-STD and IPC Test Methods Experimental Background Delphi Standards hats Test System Comparison Data Final Thoughts Page 2. Acknowledgements Rick B. Snyder Delphi Delco Electronics Systems, Inc. Kokomo, IN. Timothy A. Estes Conductor Analysis Technologies, Inc. Albuquerque, NM. Page 3. History of Thermal Shock Thermal Shock Testing has been around for a long time Thermal Shock tests have been used to determine PCB & PCA reliability Air-to-air methods have longest history in Thermal Shock Significant disadvantages in cost and time Costly to run dual-chamber and liquid systems (electricity or liquid nitrogen). Air-to-air methods take a very long time Page 4. History of Thermal Shock reliability models based upon coefficient of Thermal expansion (CTE) of the device under test (DUT).
Highly Accelerated Thermal Shock (HATS™) Testing for PCB Hole Reliability Bob Neves President Integrated Reliability Test Systems, Inc. December 2003
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