How Plasma-Enhanced Surface Modification …

Ubstrate materials and the adhe-sives employed for attachmentoften do not possess the needed physicalor chemical properties to allow for goodadhesion, and require Surface Surface Modification involvesthe interaction of the plasma-generatedexcited species with a solid interface. Theplasma process results in a physical and/or chemical Modification of the first fewmolecular layers of the Surface , whilemaintaining the properties of the materials employed in themicroelectronics and optoelectronicsindustries include ceramics, glass, polymersand metals such as gold, copper, alu-minum, nickel, palladium, tungsten, andsilver. The effectiveness of the plasma onthese complex interfaces is determined bythe plasma source gases, the configurationof the plasma system and the plasmaoperating Modification processes can beclassified into four categories: Contamination Removal Surface Activation Etch Cross LinkingSelection of a specific process is deter-mined by the physical and chemical com-position of the material to be processed,as well as by the ensuing process plasma process and the subsequentprocessing steps must also be Modification is often sensitiveto time and environmental exposure, wherethe Surface may lose its plasma-inducedphysical and chemical in-line plasma systems(Figure 1), which allow the Surface mod-ification process to be performed indi-vidually immediately prior to the nextstep in the assembly process have gai

ubstrate materials and the adhe-sives employed for attachment often do not possess the needed physical or chemical properties to allow for good

Loading..

Information

Related search queries