Transcription of HP BladeSystem c-Class enclosure
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HP BladeSystem c-Class enclosure
HP BladeSystem c-Class enclosure technology brief 2. Overview of HP BladeSystem c7000 enclosure .. 3. HP Thermal Logic technologies .. 5. Active Cool fans .. 5. HP PARSEC 6. PARSEC at the server 9. Instant Thermal Monitoring .. 10. Power .. 10. Pooled power .. 11. Dynamic Power Saver mode .. 12. Power Regulator and power workload balancing .. 13. HP BladeSystem Power Sizer .. 14. I/O Infrastructure and interconnect options .. 14. Switches and pass-thru modules .. 15. Server blades .. 16. Storage blades .. 16. Mezzanine cards .. 17. Virtual Connect .. 18. Fabric connectivity and port 18. Onboard Administrator .. 21. Insight 22. 23. Summary .. 24. Appendix A. Acronyms in 25. Appendix B. Fan and server population guidelines .. 26. For more 28. Call to action .. 28. Abstract As server, storage and network technologies have changed, traditional rack-mounted infrastructure solutions have generated increased complexity of both infrastructure management and physical data center deployment.
To overcome these issues for the HP BladeSystem c-Class, HP engineers designed a new type of fan based on aircraft technology that delivers both high airflow and high pressure in a small form factor that can scale to meet future cooling needs. The …
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