HP BladeSystem c-Class enclosure

HP BladeSystem c-Class enclosure technology brief 2. Overview of HP BladeSystem c7000 enclosure .. 3. HP Thermal Logic technologies .. 5. Active Cool fans .. 5. HP PARSEC 6. PARSEC at the server 9. Instant Thermal Monitoring .. 10. Power .. 10. Pooled power .. 11. Dynamic Power Saver mode .. 12. Power Regulator and power workload balancing .. 13. HP BladeSystem Power Sizer .. 14. I/O Infrastructure and interconnect options .. 14. Switches and pass-thru modules .. 15. Server blades .. 16. Storage blades .. 16. Mezzanine cards .. 17. Virtual Connect .. 18. Fabric connectivity and port 18. Onboard Administrator .. 21. Insight 22. 23. Summary .. 24. Appendix A. Acronyms in 25. Appendix B. Fan and server population guidelines.

support modular server, interconnect, and storage components today and throughout the next several years. The enclosure is10U high and holds up to 16 server and/or storage blades plus optional redundant network and storage interconnect modules. It includes a …

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  High, Class, Enclosure, Interconnect, Bladesystem, Hp bladesystem c class enclosure

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