Transcription of HP BladeSystem c-Class enclosure
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HP BladeSystem c-Class enclosure
HP BladeSystem c-Class enclosure technology brief 2. Overview of HP BladeSystem c7000 enclosure .. 3. HP Thermal Logic technologies .. 5. Active Cool fans .. 5. HP PARSEC 6. PARSEC at the server 9. Instant Thermal Monitoring .. 10. Power .. 10. Pooled power .. 11. Dynamic Power Saver mode .. 12. Power Regulator and power workload balancing .. 13. HP BladeSystem Power Sizer .. 14. I/O Infrastructure and interconnect options .. 14. Switches and pass-thru modules .. 15. Server blades .. 16. Storage blades .. 16. Mezzanine cards .. 17. Virtual Connect .. 18. Fabric connectivity and port 18. Onboard Administrator .. 21. Insight 22. 23. Summary .. 24. Appendix A. Acronyms in 25. Appendix B. Fan and server population guidelines .. 26. For more 28. Call to action .. 28. Abstract As server, storage and network technologies have changed, traditional rack-mounted infrastructure solutions have generated increased complexity of both infrastructure management and physical data center deployment.
Overview of HP BladeSystem c7000 enclosure The HP BladeSystem c7000 enclosure, announced in June 2006, is the first enclosure implemented using the BladeSystem c-Class architecture. It is optimized for enterprise data centers. It is designed to fit into standard size HP and third-party racks, and to accommodate the c-Class form-factor
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