Transcription of HP BladeSystem c-Class enclosure
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HP BladeSystem c-Class enclosure
HP BladeSystem c-Class enclosure technology brief 2. Overview of HP BladeSystem c7000 enclosure .. 3. HP Thermal Logic technologies .. 5. Active Cool fans .. 5. HP PARSEC 6. PARSEC at the server 9. Instant Thermal Monitoring .. 10. Power .. 10. Pooled power .. 11. Dynamic Power Saver mode .. 12. Power Regulator and power workload balancing .. 13. HP BladeSystem Power Sizer .. 14. I/O Infrastructure and interconnect options .. 14. Switches and pass-thru modules .. 15. Server blades .. 16. Storage blades .. 16. Mezzanine cards .. 17. Virtual Connect .. 18. Fabric connectivity and port 18. Onboard Administrator .. 21. Insight 22.
optimization of the data center. This technology brief provides an overview of the HP BladeSystem c-Class enclosure, including Thermal Logic power and cooling technologies and interconnect options. This technology brief assumes the reader is familiar with HP ProLiant server technology and has some knowledge of general BladeSystem architecture.
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