Transcription of IC1000™ Polishing Pad - 上海翊华光电科技有限公司
{{id}} {{{paragraph}}}
Example: barber
IC1000™ Polishing Pad - 上海翊华光电科技有限公司
2004 Rohm and Haas Electronic Materials. All rights reserved. Not to be reproduced, in whole orpart, without the express permission of Rohm and Haas Electronic , Rev. 0, 9/05 DESCRIPTIONIC1000 pad is the industry-standard Polishing padfor chemical mechanical planarization (CMP). TheIC1000 pad is made of a rigid, micro-porouspolyurethane material. These properties enable theIC1000 pad to deliver localized planarization,excellent removal rates, low global non-uniformityand low defectivity. The IC1000 pad works effectivelywith slurries and conditioners to optimize CMPperformance in Tungsten, Copper, ILD, STI, andpolysilicon CONFIGURATIONT hicknessThe standard thickness for an IC1000 pad is 50 mils,but it is also offered in a thickness of 80 mils if astiffer pad is Endpoint WindowIC1000 pads are offered with a transparent urethanewindow to enable the optical endpoint technology inlea
© 2004 Rohm and Haas Electronic Materials. All rights reserved. Not to be reproduced, in whole or part, without the express permission of Rohm and Haas Electronic ...
Loading..
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Related search queries
Chemical Mechanical Planarization, Cabot Microelectronics Corporation, Planarization, ALUMINA, CERIA AND ZIRCONIA SLURRIES FOR CMP, ALUMINA, CERIA AND ZIRCONIA SLURRIES FOR CMP PLANARIZATION, Overview of SEMI F47-0706, Understandillg hydrogen silsesquioxane-based dielectric, Understandillg hydrogen silsesquioxane-based dielectric film processing, Barrier for Flexible Organic Electronics