Transcription of Improved Bonding and Grounding Methods for Electrical ...
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Improved Bonding and Grounding Methods for Electrical ...
Final Release Version, 1/23/2012 Improved Bonding and Grounding Methods for Electrical / Electronic Equipment NSRP Electrical Technologies Panel Project Report 23 January 2012 Prepared by: John Layman, Huntington Ingalls Industries DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Final Release Version, 1/23/2012 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. i Executive Summary Bonding and Grounding in accordance with MIL STD 1310, Shipboard Bonding and Grounding Methods for EMC and Safety, is time consuming and costly as currently applied.
Bonding and grounding of electrical equipment installed aboard U. S. Navy Ships must be accomplished to the requirements of MIL-STD-1310, Standard Practice for
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