Transcription of Introduction to Semiconductor Technology ...
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AN900/11001/15AN900 APPLICATION NOTEINTRODUCTION TO Semiconductor TECHNOLOGYby Microcontroller Division ApplicationsINTRODUCTIONAn integrated circuit is a small but sophisticated device implementing several electronic func-tions. It is made up of two major parts: a tiny and very fragile silicon chip (die) and a packagewhich is intended to protect the internal silicon chip and to provide users with a practical wayof handling the component. This note describes the various front-end and back-end manu-facturing processes and takes the transistor as an example, because it uses the MOS tech-nology. Actually, this Technology is used for the majority of the ICs manufactured at TO Semiconductor TECHNOLOGY1 THE FABRICATION OF A Semiconductor DEVICEThe manufacturing phase of an integrated circuit can be divided into two steps. The first,wafer fabrication, is the extremely sophisticated and intricate process of manufacturing thesilicon chip.
INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY Initially, the silicon chip forms part of a very thin (usually 650 microns ), round silicon slice: the raw wafer. Wafer diameters are typically 125, 150 or 200 mm (5, 6 or 8 inches). However raw pure silicon has a main electrical property: it is an isolating material. So some of the features
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