Transcription of IPC-4552A: Performance Specification for Electroless ...
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IPC-4552 APerformance Specificationfor Electroless Nickel/Immersion Gold (ENIG)Plating for Printed BoardsDeveloped by the Plating Processes Subcommittee (4-14) of the Fabrication Processes Committee (4-10) of IPCU sers of this publication are encouraged to participate in the development of future :IPCS upersedes:IPC-4552 with Amendments1&2 December 2012 IPC-4552 October 2002 Table of Contents1 of Scope .. Size for Thickness Measurement .. Nickel Reducing Agents Phosphorus Content .. of Precedence .. 22 APPLICABLE .. International (ASTM) .. Standardization Program .. Technologies, Inc.. Organization forStandardization (ISO) .. , Definitions and Acronyms .. Turnover (MTO) .. Corrosion Deposit .. Annular Ring Dewetting (SAD) .. 33 REQUIREMENTS OF ENIG Board Fabrication Supplier ProcessRequirements .. Plating Line Requirements .. Deposit Thickness Measurement.
Performance Specification for Electroless Nickel/ Immersion Gold (ENIG) Plating for Printed Boards Developedby the PlatingProcessesSubcommittee (4-14) of the FabricationProcesses Committee (4-10) of IPC Usersof this publicationare encouragedto participatein the developmentof futurerevisions. Contact: IPC Supersedes: IPC-4552 with Amendments
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