Transcription of IPC-4552A: Performance Specification for Electroless ...
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IPC-4552A: Performance Specification for Electroless ...
IPC-4552 APerformance Specificationfor Electroless Nickel/Immersion Gold (ENIG)Plating for Printed BoardsDeveloped by the Plating Processes Subcommittee (4-14) of the Fabrication Processes Committee (4-10) of IPCU sers of this publication are encouraged to participate in the development of future :IPCS upersedes:IPC-4552 with Amendments1&2 December 2012 IPC-4552 October 2002 Table of Contents1 of Scope .. Size for Thickness Measurement .. Nickel Reducing Agents Phosphorus Content .. of Precedence .. 22 APPLICABLE .. International (ASTM) .. Standardization Program .. Technologies, Inc.. Organization forStandardization (ISO) .. , Definitions and Acronyms .. Turnover (MTO) .. Corrosion Deposit .. Annular Ring Dewetting (SAD).
APPENDIX 9-C Method for Stripping Gold Plating from ENIG Finished PCBs by Broad Beam Argon Ion Milling..... 85 APPENDIX 10 Determination of Thickness and Phosphorus Content In Electroless Nickel (EN) Layers X-Ray Fluorescence (XRF) Spectrometry [IPC-TM-650, Method 2.3.44]..... 90 APPENDIX 11 Phosphorus Content Measure-
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