Transcription of IPC-TM-650
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The Institute for Interconnecting and Packaging Electronic Circuits Number 2215 Sanders Road Northbrook, IL 60062-6135 Subject Bonding Process Date Revision 11/98. IPC-TM-650 Originating Task Group TEST methods MANUAL SMT Mounting Adhesives Task Group (5-24d). 1 Scope In order to assess the actual performance of any Procedure given lot of material, it is necessary to apply and thermally bond the material between the substrates of interest. This Position the adhesive over the pads on the flex circuit, method describes the recommended procedure for both pre- liner-side up.
1 Scope In order to assess the actual performance of any given lot of material, it is necessary to apply and thermally bond the material between the substrates of interest. This method describes the recommended procedure for both pre-
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