Transcription of IPC-TM-650 TEST METHODS MANUAL
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IPC-TM-650 TEST METHODS MANUAL
1 ScopeMoisture absorption can cause delamination orother damage in printed boards subjected to soldering test is a process control tool to determine both the bulkmoisture content and moisture absorption rate of a printedboard. It may be used to determine whether the specimenconforms to the monitoring level of the user s performancespecification, to assist in process development, or for processcontrol. This test may not provide accurate analytical resultson all specimens, depending on the thickness of the item, thepresence of copper layers or other moisture barriers within thestructure, or the presence of any volatile compounds otherthan water. The weight of the specimen is compared beforeand after a bake operation. The bake is intended to removemost of the water (> 90%) from the sample, and the bake timeand temperature specified herein are minimums.
1 Scope Moisture absorption can cause delamination or other damage in printed boards subjected to soldering heat. This test is a process control tool to determine both the bulk moisture content and moisture absorption rate of a printed
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