Transcription of IPC-TM-650 TEST METHODS MANUAL
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IPC-TM-650 TEST METHODS MANUAL
1 ScopeThis test method is to characterize fluxes bydetermining the degradation of electrical insulation resistanceof rigid printed wiring board specimens after exposure to thespecified flux. This test is carried out at high humidity and Applicable DocumentsIPC-B-24 Surface Insulation Resistance Test BoardIPC-A-600 Acceptability of Printed BoardsIPC J-STD-004 Requirements for Soldering FluxesIPC-9201 Surface Insulation Resistance Handbook3 Test SpecimenA minimum of 10 ml of liquid flux, a rep-resentative container of solder paste, cored wire, paste flux, orextracted solder preform flux. The reflow/extraction processshould be carried out in accordance with IPC Comb PatternsUse the IPC-B-24 test pattern (seeFigure 1), which consists of four comb patterns per individual comb has mm lines and mm metallization shall be unpreserved bare LaminatThe laminate material for this test shall beFR-4 clean test chamber capable of programming andrecording an environment of 25 +10/-2 C [77 + 18/-3 F] toat least 85 2 C [185]
In addition, there shall be at least two unprocessed control coupons for comparison purposes (Table 1, Sample Group F). 5.2.1 Positive, permanent and noncontaminating identifica- tion of test specimens is of paramount importance.
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