Transcription of IPC-TM-650 TEST METHODS MANUAL (D-32) 1 …
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IPC-TM-650 TEST METHODS MANUAL (D-32) 1 …
1 Scope and ScopeThis methodshallbe used to simulate expo-sure to the thermal conditions by convection reflow PurposeThis methodshallbe used to replicate thethermodynamic effects by assembly on the test use of this method is intended to simulate those effectsthat are the result of soldering thermal methodshallbe used for qualification testing ofan applicable test specimen. The evaluation of acceptabilityfor qualificationshallbe in accordance with the requirementsdefined in method may be used for lot acceptance. Theevaluation for lot acceptability should be in accordance withthe requirements defined in or as agreed upon betweenuser and supplier (AABUS).2 Applicable DocumentsIPC-T-50 Terms and DefinitionsIPC-2221 Generic Standard on Printed Board DesignIPC-A-600 Acceptability of Printed BoardsIPC-1601 Printed Board Handling and Storage GuidelinesIPC-6012 Qualification and Performance Specification forRigid Printed BoardsIPC-6013 Qualification and Performance Specification forFlexible Printed BoardsIPC-6018 Qualification and Performance Specification forHigh Frequency (Microwave) Printed BoardsIPC-9241 Guidelines for Microsection PreparationIPC-9631 User s Guide for IPC-TM-650 , Method METHODS Microsectioning Microsectioning, MANUAL and Semior Automatic Method3 Test Design/Construction test specimenshallbe the A/B, AB-R, and/or theD coupon in accor
1 Scope and Purpose 1.1 Scope This method shall be used to simulate expo- sure to the thermal conditions by convection reflow assembly. 1.2 Purpose This method shall be used to replicate the thermodynamic effects by assembly on the test specimen.
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