Transcription of IPC-TM-650 TEST METHODS MANUAL (D-32) 1 …
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IPC-TM-650 TEST METHODS MANUAL (D-32) 1 …
1 Scope and ScopeThis methodshallbe used to simulate expo-sure to the thermal conditions by convection reflow PurposeThis methodshallbe used to replicate thethermodynamic effects by assembly on the test use of this method is intended to simulate those effectsthat are the result of soldering thermal methodshallbe used for qualification testing ofan applicable test specimen. The evaluation of acceptabilityfor qualificationshallbe in accordance with the requirementsdefined in method may be used for lot acceptance.
IPC-2627-5-2 Figure 5-2 230 °C Reflow Profile Chart (Low Temperature Profile)* * The times to t1, t2 and t3 may vary based on the mass of the sample test specimen.
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