Transcription of IT-158 Data Sheet - 聯茂電子
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IT-158 Data Sheet - 聯茂電子
DRAFT REV IT-158 Low CTE / High Reliability Laminate & Prepreg Excellent CAF resistance Good through-hole reliability Lead Free , Middle Tg and high thermal reliability For automotive, HDI and networking applications Laminate properties Items IPC TM-650 Typical Value Unit Peel Strength, minimum A. Low profile copper foil B. Standard profile copper foil 5 8 lb/inch Volume Resistivity 1x109 M -cm Surface Resistivity 1x108 M Moisture Absorption, maximum % Permittivity (Dk, 50% resin content) A. 1 GHz B. 2 GHz C. 5 GHz D. 10 GHz -- Loss Tangent (Df, 50% resin content) A. 1 GHz B. 2 GHz C. 5 GHz D. 10 GHz -- Flexural Strength, minimum A. Length direction B.
DRAFT REV 0.5-17 IT-158 Low CTE / High Reliability Laminate & Prepreg Excellent CAF resistance Good through-hole reliability Lead Free , Middle Tg and high thermal reliability
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