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JOINT INDUSTRY STANDARD - IPC

JOINTINDUSTRYSTANDARDR equirements forSoldering FluxesAmendment 1 IPC J-STD-004 BAmendment 1 November 2011 Requirements for Soldering FluxesEditorial PurposeThe purpose of this STANDARD is to classify and characterize tin/lead and lead- free soldering flux materials foruse in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the fol-lowing: liquid flux, paste flux, solder paste, solder cream as well as flux-coated and flux-cored solder wires and is not the intent of this STANDARD to exclude any acceptable flux or soldering material; however, these materials must pro-duce the desired electrical and metallurgical in Note 1 Table 1-1 Flux Identification SystemNote 1. Halide measuring < by weight in flux solids may be known as halide- free .

Requirements for Soldering Fluxes Editorial Change 1.2 Purpose The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for

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