Transcription of JOINT INDUSTRY STANDARD - IPC
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JOINT INDUSTRY STANDARD - IPC
JOINTINDUSTRYSTANDARDR equirements forSoldering FluxesAmendment 1 IPC J-STD-004 BAmendment 1 November 2011 Requirements for Soldering FluxesEditorial PurposeThe purpose of this STANDARD is to classify and characterize tin/lead and lead-free soldering flux materials foruse in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the fol-lowing: liquid flux, paste flux, solder paste, solder cream as well as flux-coated and flux-cored solder wires and is not the intent of this STANDARD to exclude any acceptable flux or soldering material; however, these materials must pro-duce the desired electrical and metallurgical in Note 1 Table 1-1 Flux Identification SystemNote 1.
Editorial Change to Note 1. Table 3-2 Test Requirements for Flux Classification Note 1. This method determines the amount of halide present (see Appendix B-10).
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