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“Making of a Chip”

Copyright 2012, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the and other countries. 1 Making of a Chip Illustrations 22nm 3D/Trigate Transistors Version January 2012 Copyright 2012, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the and other countries. 2 The illustrations on the following foils are low resolution images that visually support the explanations of the individual steps. For publishing purposes there are high resolution JPEG files posted to the Intel website: Optionally same resolution (uncompressed) images are available as well. Please request them from Copyright 2012, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the and other countries.

scale: die level (~10mm / ~0.5 inch) This portion of a ready wafer is being put through a test. A tester steps across the wafer; leads from its head make contact on specific points on the top of the wafer and an electrical test is performed. Test patterns are fed into every single chip and the response from the chip is monitored and compared to

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