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“Making of a Chip”

Copyright 2012, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the and other countries. 1 Making of a chip Illustrations 22nm 3D/Trigate Transistors Version January 2012 Copyright 2012, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the and other countries. 2 The illustrations on the following foils are low resolution images that visually support the explanations of the individual steps. For publishing purposes there are high resolution JPEG files posted to the Intel website: Optionally same resolution (uncompressed) images are available as well. Please request them from Copyright 2012, Intel Corporation. All rights reserved. Intel, Intel logo and Intel Core are trademarks of Intel Corporation in the and other countries.

scale: transistor level (~50-200nm) The excess material is mechanically polished away to reveal a specific pattern of copper. Metal Layers – scale: transistor level (six transistors combined ~500nm) Multiple metal layers are created to interconnect (think: wires) all the transistors on the chip in a specific configuration.

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