Memory Module Specifi cations - Kingston Technology
64-bit (8GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 1Rx8, non-ECC, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. This 260-pin DIMM uses gold contact fingers. The electrical and mechanical specifications are as follows: CL(IDD) Row Cycle Time …
Tags:
Technology, Synchronous, Kingston, Ardms, Sdram, Kingston technology, Synchronous dram
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Documents from same domain
Memory Module Specifi cations - Kingston
www.kingston.comDESCRIPTION Document No. VALUERAM1445-001.C00 12/18/15 Page 1 SPECIFICATIONS *Power will vary depending on the SDRAM used. Continued >> kingston.com
Memory Module Specifi cations - Kingston
www.kingston.comDESCRIPTION Document No. VALUERAM1446-001.C00 02/24/15 Page 1 SPECIFICATIONS *Power will vary depending on the SDRAM used. KVR21R15S4/8 8GB 1Rx4 1G x 72-Bit PC4-2133
Memory Module Specifications - Kingston
www.kingston.comDESCRIPTION SPECIFICATIONS *Power will vary depending on the SDRAM used. HX421C14FBK4/64 64GB (16GB 2G x 64-Bit x 4 pcs.) DDR4-2133 CL14 288-Pin DIMM
Memory Module Specifi cations - kingston.com
www.kingston.comDESCRIPTION SPECIFICATIONS *Power will vary depending on the SDRAM used. KVR24S17S8/8 8GB 1Rx8 1G x 64-Bit PC4-2400 CL17 260-Pin SODIMM Continued >> FEATURES
Memory Module Specifi cations - Kingston
www.kingston.comKVR1333D3N9/8G 8GB 2Rx8 1G x 64-Bit PC3-10600 CL9 240-Pin DIMM DESCRIPTION This document describes ValueRAM's 1G x 64-bit (8GB) DDR3-1333 CL9 SDRAM (Synchronous DRAM), 2Rx8, memory
Memory, Module, Action, Specifi, Memory module specifi cations
microSDHC/microSDXC Class 10 UHS-I Card
www.kingston.comTHIS DOCUMENT SUBJECT TO CHANGE WITHOUT NOTICE. ©2017 Kingston Technology Europe Co LLP und Kingston Digital Europe Co LLP, Kingston Court, Brooklands Close,
Technology, Class, Kingston, Microsdhc microsdxc class 10 uhs, Microsdhc, Microsdxc, Kingston technology
Memory Module Specifi cations - Kingston
www.kingston.comKVR1333D3N9/2G 2GB 2Rx8 256M x 64-Bit PC3-10600 CL9 240-Pin DIMM DESCRIPTION This document describes ValueRAM's 256M x 64-bit (2GB) DDR3 …
Memory Module Specifi cations - kingston.com
www.kingston.comKVR16LS11/4 4GB 1Rx8 512M x 64-Bit PC3L-12800 CL11 204-Pin SODIMM DESCRIPTION This document describes ValueRAM's 512M x 64-bit (4GB) DDR3L …
1. Introduction - Kingston Technology
www.kingston.com1 to 4 bi-directional data signals. After power up, the microSD card will use only DAT0 by default. After initialisation, the host can change the bus width. Multiplied microSD card connections are available to the host. Common Vdd, Vss and CLK signal connections are …
Introduction, Technology, Directional, Kingston, Kingston technology
HX421C14FB/8 - Kingston Technology
www.kingston.com31.25 17.60 133.35 129.55 Detail A 14.60 3.00 28.90 Pin 1 Pin 35 Pin 47 22.95 Pin 105 Pin 117 Detail BDetail D Detail C 8.00 11.00 MODULE WITH HEAT SPREADER 7.08 mm 133.35 mm 34.04 mm. Title: HX421C14FB_8.ai Author: kfujiwar Created Date:
Related documents
8Gb C-die DDR4 SDRAM x16 - Samsung us
www.samsung.comThe 8Gb DDR4 SDRAM C-die is organized as a 64Mbit x 16 I/Os x 8banks device. This synchronous device achieves high speed double-data-rate transfer rates of up to 2666Mb/sec/pin (DDR4-2666) for general applica-tions. The chip is designed to comply with the following key DDR4 SDRAM fea-
KVR667D2N5/1G
www.kingston.com(1024MB) DDR2-667 CL5 SDRAM (Synchronous DRAM) memory module. The components on this module include eight 128M x 8-bit DDR2-667 SDRAM in FBGA packages. This 240-pin DIMM uses gold contact fingers and requires +1.8V. The electrical and mechanical specifications are as follows: SPECIFICATIONS Clock Cycle Time (tCK) CL=5 3ns (min.) / 8ns (max.)
NanoStationM & NanoStationlocoM Datasheet
dl.ubnt.comMemory 32 MB SDRAM, 8 MB Flash Frequency 2.4 GHz Cross-pol Isolation 23 dB Minimum Max. VSWR 1.6:1 Beamwidth 55° (H-pol) / 53° (V-pol) / 27° (Elevation) Polarization Dual Linear Enclosure Outdoor UV Stabilized Plastic Mounting Pole-Mount (Kit Included) Operating Temperature -30 to 75° C (-22 to 167° F) Operating Humidity 5 to 95% Noncondensing
Intel® NUC Kit/Mini PC NUC11PHKi7C
www.intel.comMemory Two 260 -pin 1.2 V DDR4 SDRAM Small Outline Dual Inline Memory Module (SO DIMM) sockets • Support for DDR4 1866/2133/2400/3200 MHz SO-DIMMs • Support for 8 Gb and 16 Gb technology • Support for up to 64 GB of system memory with two SO-DIMMs using 32 GB memory modules • Support for non-ECC memory
Intel, Mini, Sdram, Nuc kit mini pc nuc11phki7c, Nuc11phki7c
Dell OptiPlex 780 Setup and Features Information
downloads.dell.comType 1066 MHz DDR3 SDRAM (non-ECC only) Minimum memory 1 GB Maximum memory 16 GB Drives Externally accessible: 5.25-inch drive bays Mini-Tower — two Desktop — one 5.25-inch slimline bay Small Form Factor — one 3.5-inch drive bay Mini-Tower and Desktop — one 3.5-inch slimline bay Small Form Factor — one
Atmel SAM3X8E SAM3X8C SAM3X4E SAM3X4C SAM3A8C …
ww1.microchip.comAtmel-11057C-ATARM-SAM3X-SAM3A-Datasheet_23-Mar-15 Description The Atmel | SMART SAM3X/A series is a member of a family of Flash microcontrollers based on the high performance 32-bit ARM Cortex -M3 RISC processor. It operates …