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Modeling of Integrated RF Passive Devices - …
Modeling of Integrated RF Passive DevicesSharad Kapur and David E. LongCustom Integrated Circuits Conference, Introduction and motivation Three topics EM simulation using Integral methods Modeling layout dependent effects Circuit models and component synthesis Experiments ConclusionsOutline2 Applications Applications Mobile Wireless (WiFi, WiMax) Wired (Ethernet) Storage (Hard disks) Passive components found these Devices A decade ago inductors, MIM capactors Now a whole range of components and Devices are being used3 Tech trends Thick metals 3um to 8um copper High-resistivity substrates 10 -cm to 1000 -cm Fine feature sizes m width at 65nm Many metal layers High density MOM capacitors instead of MIM (2fF vs 4fF)4 IC processes offer tight tolerances Low variability Chip real estate is expensive Integration offers big cost savings No extra packaging Much tighter tolerances and better yield When a device can be built with reasonable quality compared to an off-chip or an
Modeling of Integrated RF Passive Devices Sharad Kapur and David E. Long Custom Integrated Circuits Conference, 2010 www.integrandsoftware.com Introduction …
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