Transcription of MPC5777C , MPC5777C Microcontroller Data Sheet
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MPC5777C , MPC5777C Microcontroller Data Sheet
MPC5777 CMPC5777C MicrocontrollerData SheetFeatures This document provides electrical specifications, pinassignments, and package diagram information for theMPC5777C series of Microcontroller units (MCUs). For functional characteristics and the programmingmodel, see the MPC5777C Reference SemiconductorsDocument Number MPC5777 CData Sheet : Technical DataRev. 15, 03/2021 NXP reserves the right to change the production detail specifications as may berequired to permit improvements in the design of its of MAPBGA pin MAPBGA pin maximum interference (EMI) discharge (ESD) electrical pad pad pad pad current and PLL electrical electrical electrical Converter (ADC) electrical Queued Analog-to-Digital Converter(eQADC).. ADC (SDADC).. Fast Asynchronous Serial Transmission (LFAST) padelectrical interface timing and MSC/DSPI LVDS interface PLL electrical management: PMC, POR/LVD, power management electrical management voltage sequencing memory memory program and erase memory Array Integrity and Margin memory module life retention vs program/erase memory AC timing memory read wait-state and address-pipeline control timing and configuration pin interface Bus Interface (EBI) i
• Instruction set enhancement allowing variable length encoding (VLE), optional encoding of mixed 16-bit and 32-bit instructions, for code size footprint reduction • On the two computational cores: Signal processing extension (SPE1.1) instruction support for digital signal processing (DSP) • Single-precision floating point operations
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