Transcription of New Logic Packaging - TI
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New Logic Packaging - TI
New Logic Packaging4Q 2003 RELIABLE. Logic . INNOVATION. Instruments New Logic PackagingWCSP Introduction (NanoStarTM/NanoFreeTM)NanoStarTMand NanoFreeTMis the smallest industry standardlogic package with proven world-class reliability designed fortoday's high-volume manufacturing environment. TexasInstruments now offers 5, 6, and 8-ball NanoStarTM(YEP/YZP),the smallest single-gate Logic package available. NanoStarTM, achip scaled package technology, is a major breakthrough in ICpackaging concepts, using the die as the package. At mm2,it has a footprint that is 70% smaller than the industry standardSC-70 (DCK) and 13% smaller than any other Logic packageavailable. NanoStarTMpackaging allows manufacturers to placemore functions in a tighter space while improving systemperformance. The end products are smaller sized, more richlyfeatured, portable electronics demanded by consumers.
logic.ti.com 4 Texas Instruments New Logic Packaging Small Package Thin Package Light Package High Reliability/Quality 5/6/8-ball Testability Industry's Small Leading Package Footprint Area (mm2) Max Heights (mm)
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