Non-Contact Probes for On-Wafer Characterization ofSub ...

1. Non-Contact Probes for On-Wafer Characterization of Sub- millimeter Wave Devices and Integrated Circuits Cosan Caglayan, Student Member, IEEE, Georgios C. Trichopoulos, Member, IEEE, and Kubilay Sertel, Senior Member, IEEE. Abstract We present a novel, Non-Contact metrology approach approaching the 1 THz barrier. Nonetheless, a design trade- for On-Wafer Characterization of sub- millimeter wave devices, off between power handling and fast switching is typically components, and integrated circuits. Unlike existing contact encountered with conventional device topologies. To address Probes that rely on small metallic tips that make physical contact with the device on the chip, the new Non-Contact Probes are this bottleneck and further extend device performance to the based on electromagnetic coupling of vector network analyzer THz band, novel and unconventional device topologies, such (VNA) test ports into the coplanar waveguide environment as plasma wave field effect transistors (FETs) [6] and het- of integrated devices and circuits.

1 Non-Contact Probes for On-Wafer Characterization ofSub-millimeter WaveDevices and Integrated Circuits Cosan Caglayan, Student Member, IEEE, Georgios C. …

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  Characterization, Millimeter, Wafer, Wafer characterization ofsub millimeter wavedevices and, Ofsub, Wavedevices

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