Transcription of NXP Semiconductors Data Sheet: Technical Data ΣΔ …
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NXP Semiconductors Data Sheet: Technical Data ΣΔ …
S32R274S32R274/S32R264 SeriesData SheetSupports S32R274K, S32R274J,S32R264K and S32R264 JFeatures On-chip modules available within the device includethe following features: Safety core: Power Architecture e200Z4 32-bit CPUwith checker core Dual issue computation cores: Power Architecture e200Z7 32-bit CPU 2 MB on-chip code flash (FMC flash) with ECC MB on-chip SRAM with ECC RADAR processing Signal Processing Toolbox (SPT) for RADAR signalprocessing acceleration Cross Timing Engine (CTE) for precise timinggeneration and triggering Waveform generation module (WGM) for chirpramp generation 4x 12-bit -ADC with 10 MSps One DAC with 10 MSps MIPICSI2 interface to connect external ADCs Memory Protection Each core memory protection unit provides 24entries Data and instruction bus system memory protectionunit (SMPU) with 16 region descriptors each Register protection Clock Generation 40 MHz external crystal (XOSC)
S32R274 S32R274/S32R264 Series Data Sheet Supports S32R274K, S32R274J, S32R264K and S32R264J Features • On-chip modules available within the device include
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