Transcription of Package Application Note for QFN and DFN Packages
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Package Application Note for QFN and DFN Packages
AN2089. Package Application Note for QFN and DFN Packages Authors: Simeon Iliev Package DESCRIPTION AND. Microchip Technology Inc. CONSTRUCTION. QFN and DFN Packages are plastic encapsulated lead- INTRODUCTION frame-based Packages , which are near Chip Scale Package (CSP) with a low profile (< mm). This pack- This Package Application note provides the guidelines age type uses perimeter lands/pins on the bottom of for the handling and assembly of Microchip QFN and the Package to provide electrical contacts to the PCB. DFN Packages during the Printed Circuit Board (PCB) Perimeter pins can be arranged in dual-in-line (DFN) or assembly. In addition, it provides general information quad (QFN) configuration. Pins in DFN Packages , for the PCB land pattern design and component rework when rectangular, can be arranged on the short side guidelines.
Jul 14, 2015 · through conductive die attach material. The QFN and DFN packages are offered in various pincounts and body sizes, and have the following features: • Small overall dimensions, compared to leaded packages, which helps maximize board space • Thermally enhanced plastic package • Very high design flexibility due to the etching process of the ...
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