Transcription of PACKAGE QUALIFICATION SUMMARY REPORT
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PACKAGE QUALIFICATION SUMMARY REPORT
PACKAGE QUALIFICATION SUMMARY REPORT Document Control #: ML1120110066 Purpose: To provide QUALIFICATION SUMMARY REPORT for all packages Device: Various Mask Identification #: Various Process Technology: Pure Matte Tin (Sn) Plating Process 400 in (10 m) 1000 in (25 m), Pre-Plated Leadframe (PPF), or SnAgCu based solder bump Product: Various devices plated with Matte Tin, PPF, or with solder spheres Updated: May 18, 2017 PACKAGE QUALIFICATION SUMMARY REPORT DOCUMENT CONTROL # ML1120110066 Microchip Technology Inc. 2 PACKAGE QUALIFICATION SUMMARY REPORT CONTENTS 1) QUALIFICATION OVERVIEW 2) RELIABILITY TEST DESCRIPTIONS 3) QUALIFICATION RESULTS & RELEASE STATUS 4) CONCLUSION RESULTS SUMMARY The assembly using Matte Tin plating, PPF or solder spheres complies with the reliability guidelines documented in the QUALIFICATION plan.
PACKAGE QUALIFICATION SUMMARY REPORT Document Control #: ML1120110066 Purpose: To provide qualification summary report for all packages
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