Transcription of Panel Discussion: Advanced Packaging - The ConFab
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Panel Discussion: Advanced Packaging - The ConFab
Dr. Steve Bezuk Senior Director IC Packaging Engineering Qualcomm Technologies, Inc. Panel discussion : Advanced Packaging PAGE 1. Technical Challenges of Packaging (Mobile Focus). Materials Thermal Die materials Poor Thermal Paths Low K and Extreme Low K Dielectrics No Air Flow, Closed System Fine Pitch Interconnects (<100mm) Substrate materials engineered for: Electrical Modulus, fracture toughness, CTE, Tg, Signal Integrity shrinkage, cure temperature and kinetics, adhesion to multiple materials, dielectric Power DistribuLon properties (frequency dependence), .. FuncLonal ParLLoning Mechanical Ultra thin die ( 100mm) Evolution of Si nodes in last 5 yrs CTE Mismatch 14/16 7. Warpage Control 28nm 20nm nm 10 nm nm Preserving Si Strain Engineering 1st gen 2nd gen 3rd gen FINFET FINFET FINFET. 2017 QUALCOMM Incorporated. All rights reserved PAGE 2. Interconnect Trends for Packages FC Interconnect using SOP Fine Pitch FC used in mobile devices DieSOP.
PAGE 1 Panel Discussion: Advanced Packaging Dr. Steve Bezuk Senior Director IC Packaging Engineering Qualcomm Technologies, Inc.
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