Transcription of Panel Discussion: Advanced Packaging - The ConFab
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Panel Discussion: Advanced Packaging - The ConFab
Dr. Steve Bezuk Senior Director IC Packaging Engineering Qualcomm Technologies, Inc. Panel discussion : Advanced Packaging PAGE 1. Technical Challenges of Packaging (Mobile Focus). Materials Thermal Die materials Poor Thermal Paths Low K and Extreme Low K Dielectrics No Air Flow, Closed System Fine Pitch Interconnects (<100mm) Substrate materials engineered for: Electrical Modulus, fracture toughness, CTE, Tg, Signal Integrity shrinkage, cure temperature and kinetics, adhesion to multiple materials, dielectric Power DistribuLon properties (frequency dependence), .. FuncLonal ParLLoning Mechanical Ultra thin die ( 100mm) Evolution of Si nodes in last 5 yrs CTE Mismatch 14/16 7. Warpage Control 28nm 20nm nm 10 nm nm Preserving Si Strain Engineering 1st gen 2nd gen 3rd gen FINFET FINFET FINFET. 2017 QUALCOMM Incorporated.
PAGE 6 Wafer Batch Processed Package Evolution WLP Face Down FOWLP WLP with Sidewall Prot. Face Up WLP/ FOWLP Face Down FOWLP POP Face Up FOWLP
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