Part II How to Design and Build Working Electronic Circuits

2005 Hongshen Ma Part II How to Design and Build Working Electronic Circuits By Hongshen Ma 2005 Hongshen Ma Important note: This document is a rough draft of the proposed textbook. Many of the sections and figures need to be revised and/or are missing. Please check future releases for more complete versions of this text. 2005 Hongshen Ma Outline Part II How to Design and Build Working Electronic Circuits 11 Reading Datasheets 12 Electronic Packaging Through-Hole Surface Mount Ball Grid Array Comparing Packaging Technologies 13 Specifications of Discrete Components Resistors Capacitors Ceramic Capacitors Electrolytic Capacitors Tantalum Capacitors Diodes Transistors 14 Power Supply Circuits Power Supply Basics Bypass Capacitors Linear Voltage Regulators Switching DC-DC Converters 15 Understanding Op Amp Specifications Power Supply Range Input and Output Voltage Range Input Offset Voltage Input Bias Current Gain-Bandwidth Product

indicated by a physical indentation or a printed dot on the package. 12.2 Surface-Mount Surface-mount (SMT) components contain flat metal leads which are soldered directly onto corresponding metal pads on top of the circuit board. Since drilled holes are not required, a SMT component can typically be packaged into a smaller volume than a

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  Printed, Electronic, Board, Circuit, Flat, Circuit board

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