Transcription of PCB Design Guidelines For Reduced EMI - Texas Instruments
{{id}} {{{paragraph}}}
Example: barber
PCB Design Guidelines For Reduced EMI - Texas Instruments
PCB Design Guidelines For Reduced EMI. SZZA009. November 1999. 1. IMPORTANT NOTICE. Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
the third noise source has been addressed. Also, critical information is disclosed on board zoning (floor planning) and shieldi ng. 1.2 Surface-Mount Devices vs Through-Hole Components Surface-mount devices (SMD) are better than leaded devices in dealing with RF energy because of the reduced inductances and closer component placements available.
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document: