Transcription of PCB Fabrication Processes Brief Introduction - Abbysan.com
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PCB Fabrication Processes Brief Introduction - Abbysan.com
PCB FabricationProcessesBrief IntroductionOrig2004/08/21 Edit2011/01/04 ContentsPCB Processes Flow Chart ..(001) Layer Processing ..(002) Lamination ..(032)7 ..(058)10 Plating ..(071)11 Layer (102)136. 1. Solder Mask ..(123)15 6. 2. Silk Screen ..(147)17 7. 1. Gold Finger Plating ..(158)18 7. 2. HASL ..(173)20 7. 3. Routing ..(190)21 Test & FQC ..(205)22 PCB FabricationProcesses Brief Introduction3D/S BoardLaminationENIG G/F PlatingHASL PackingShippingM/L s I/L manufactureHASLF inal Finish according to customer requirementDrillingCopper PlatingOuter LayerSolder MaskSilk ScreenE-Test & FQCOQCE ntek OSPI mmersion AgOQCE-Test& FQCR outingI/L CuttingPCB Processes Flow Chart4 RoutingG/F PlatingEntek OSP or Immersion Silver should be applied afterFQCI nner Layer ProcessingBase materials before cuttingBase materials after cuttingStack
Mass Lamination Process 2-1 Brown Oxide Inner layer surface before brown oxidation Inner layer surface after brown oxidation 2-2 Pre Lay-up Cut prepreg before pre-layup
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