Transcription of PCB FABRICATION - Sanmina
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PCB FABRICATION - Sanmina
PCB FABRICATION Phenolic-cured materials can withstand the Substituting Dicy-cured FR-4 Materials with Phenolic-cured Materials increased temperatures of lead-free processes. But how do they effect performance? Dicy-cured FR-4 materials have been used for decades to mount electrical components to printed circuit Considerations for lead free: boards (PCBs). Traditionally composed of woven- Traditional FR-4 materials decompose in the higher processing glass reinforcement materials and an epoxy resin with temperatures needed for lead-free solder a dicyandiamide (dicy) cure agent, dicy-cured FR-4 The altered resin content of phenolic-cured materials may impact materials are commonly used in processes that utilize signal propagation delays and noise margins Tin-Lead-based solder such as automated-wave, hot- air or hand-soldering assembly techniques.
Recognizing these potential effects, Sanmina-SCI® began investigating the relationship between phe-nolic-cured FR-4 materials and process capability,
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