Transcription of PolyMUMPs Design Handbook - MEMSCAP
{{id}} {{{paragraph}}}
PolyMUMPs Design Handbook a MUMPs process Allen Cowen, Busbee Hardy, Ramaswamy Mahadevan, and Steve Wilcenski MEMSCAP Inc. Revision Copyright 1992-2011 by MEMSCAP . All rights reserved. Permission to use and copy for internal, noncommercial purposes is hereby granted. Any distribution of this manual or associated layouts or any part thereof is strictly prohibited without prior written consent of MEMSCAP . Inc. GDSII is a trademark of Calma, Valid, Cadence. L-Edit and Tanner Database are trademarks of Tanner Research Inc. Table of Contents Chapter 1. Three-Layer Polysilicon Surface Micromachining Process .. 1. Introduction .. 1. Process Overview .. 2. Chapter 2. PolyMUMPs Design Guidelines and Rules .. 11. Introduction .. 11. Design Rules .. 12. Beyond the Design 31. Film Parameters.
CHAPTER 1 2 PolyMUMPs™ Design Handbook, Rev. 13.0 FIGURE 1.1. Cross sectional view showing all 7 layers of the PolyMUMPs process (not to scale). Poly0 Poly1 Poly2 Metal Nitride 1st Oxide 2nd Oxide Figure 1.1 is a cross section of the three-layer polysilicon surface micromachining PolyMUMPs process.
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}
Distribution Insulator Cross Re, Distribution Insulator Cross, Pipeline Seal and Insulator, Inc, Wire, Cross, POWER SYSTEMS, INC, Distribution, Chapter 6 ELECTRON TRANSPORT, Management within the Victorian Electricity Supply Industry, CABLE ACCESSORIES - Application, Design, Installation, Testing, WithEffective from 10.01.2017