Transcription of Post Exposure Bake (PEB) - microchemicals.com
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Post Exposure Bake (PEB) - microchemicals.com
Chapter01 MicroChemicals Fundamentals of of Exposure BAKEThe term "post Exposure bake" (PEB) refers to a baking step of the resist fi lm which follows the Exposure . Since the resist fi lm is not yet developed, that is to say closed, the PEB can also be applied without diffi culty above the softening temperature of the photoresist. There are several completely diff erent possible reasons for a PEB that are explained in this Amplifi ed Positive ResistsMechanismWhile with "normal" positive resists, the photoreaction with the Exposure is completed, chemically ampli-fi ed photoresists need a subsequent baking step.
AZ® 726 MIF is 2.38 % TMAH- (TetraMethylAmmoniumHydroxide) in water, with additional surfactants for rapid and uniform wetting of the substrate (e. g. for puddle development) AZ® 826 MIF is 2.38 % TMAH- (TetraMethylAmmoniumHydroxide) in water, with additional surfactants for rapid and uniform wetting of the substrate (e. g. for puddle development) and other additives for the removal of ...
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