Transcription of Preserving signal integrity. PCB FABRICATION Backdrilling ...
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Preserving signal integrity. PCB FABRICATION Backdrilling ...
Preserving signal integrity. PCB FABRICATION Backdrilling and Blind/Buried Via Formation techniques eliminate Backdrilling and Blind/Buried Via Formation via stubs that degrade signal integrity. Backplanes and other thick-format boards can endure significant signal Integrity (SI) disturbances as a result Key advantages include: of the unused portions of through-holes and vias that Reduced deterministic jitter Reduced EMI/EMC radiation from extend past their last connected layer. Known as Lower bit error rate (BER) the stub end stubs, these unused portions result in reflections, Less signal attenuation with Reduced excitation of resonance capacitance, inductance and impedance discontinuities improved impedance matching modes losses that become critical as propagation speeds Minimal design and layout impact Reduced via-to-via crosstalk increase. Increased channel bandwidth Lower costs than sequential Increased data rates laminations A simple and effective method for managing these stubs is Backdrilling .
A second CDD technique for managing stubs is the formation of plated blind vias which prevent stubs from forming altogether. Blind Via Formation
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