超高耐熱ビスマレイミド系樹脂 ... - printec.co.jp

H 3030/3032/3070 /Article /Method /unit 3030 3032 3070 /Molecular weight 670 1000 660 /Softeng point /Flow tester C 78 75 No data /Melt viscosity 150 C ) ICI /150 C No data /Gel Time /Hot plate 171 C sec 2600 1600 1500 *IPN * IPN Typical physically Properties of molding compound /Formulation /Condition: 100 C 2 /Roll Mixting 180 C / Molding temp /item 3030 3032 /Epoxy 0% 0% HR Resin /Sillica /Others /Tg Affter Cure 0 200 C*4h 230 C 4h TMA 244/257/263 -/290/298 /Themal Decomposition C 200 C 4 weight loss 1%/5% 230 C 4 weight loss 1%/5% TG-DTA 10 C/min 360/460 360/460 380/470 384/467 /Mold Shrinkage Affter Cure 0 200 C*4h 230 C 4h JIS K6911 0 0 /Flexural strength (Mpa) 200 C/230 C 164/167 170/172 /Flexural modulus (Mpa) 200 C/230 C 22100/21900 21900 /CTE ppm/ C 1 2 200 C 4 TMA 12/44 15/65 /SF 180 C inch 18 32 /Gel time 180 C sec /Brabender 43 48 Low softening point, ultrahigh heat resistance, high thermal decomposition temperature, low shrinkage bismaleimide resin 1 January 23,2018 /Formulation /i

上記数値は参考値であり保証するものはありません. 超高耐熱ビスマレイミド系樹脂. H. R. 3030/3032/3070 . 項目/Article

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