SAMFA ELECTROPLATING EXPLAINED

DEFINITIONBASIC ELECTROCHEMISTRYE lectroplating is a method of using an electric current to deposit a thin layer of metal over another from a solution containing a dissolved salt of the selected metal. In order for this to happen we have to create a closed circuit, an electrolytic cell, where each element in the system is of equal importance. These components are: A source of adjustable direct current, most commonly a transformer-rectifier with positive and negative terminals rigged for cable or busbar connections. In the trade this piece of equipment is usually referred to by its short name the rectifier . The electrodes that can be described as follows:?An anode connected to the positive terminal; the anode is generally composed of the material that we want to deposit. Copper in the case of copper plating, nickel in the case of nickel plating and so on. It is also possible to plate using inert anodes like carbon rods in certain cathode connected to the negative terminal; the cathode is the component on which we intend to deposit the metal.

metal bearing salts. The correct term for this solution is the “electrolyte” but in the plating shop it is generally simply referred to as the “solution”.

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