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! LiTEZenith LiTE 3D AOI with RevolutionaryNew 3D MeasurementThe Zenith LiTE 3D AOI system provides full 3D inspection of components,patterns, holes and even foreign material on assembled PCBs with true 3D measurement. Koh Young Technology offers accurate and fast 3D inspection overcoming the shortcomings and vulnerabilities of conventional 2D 3D measurement values to program and to set inspection conditions, Zenith LiTE 3D AOI system provides users with intuitive and user friendly software. Results can be reviewed together with Koh Young s 3D SPI inspection results, to enable easier verification and analysis of and Quantifies All DefectsMissing, Offset, Rotation, Polarity, Upside Down, OCV, Solder Fillet, Billboarding, Lifted Lead, Lifted Body, Tombstone, Bridging and more. Lifted BodyLED Component DefectNo SolderJudging Solder Fillet DefectsUsing 3D Height and Volume Measurement ValuesUsing patented 4-way projection technology and multi-frequency height measurement, Zenith LiTE provides a wide range of measurement while maintaining the high Body(Body Coplanarity)Solder Joint DefectsLifted Lead(Lead Coplanarity)Judge Defect by Measured Component Height ProfileFull 3D Inspection of Solder JointJudge Defect by Measured Lead Shape ProfileMeasured lead hei

Zenith LiTE 3D AOI with Revolutionary New 3D Measurement The Zenith LiTE 3D AOI system provides full 3D inspection of components,patterns, holes and even foreign material on assembled PCBs with true 3D measurement.

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