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SEMICONDUCTOR FABRICATION FACILITIES - …
2014 OREGON FIRE CODE245 CHAPTER 27 SEMICONDUCTOR FABRICATION FACILITIESSECTION Scope. SEMICONDUCTOR FABRICATION FACILITIES and com-parable research and development areas classified as GroupH-5 shall comply with this chapter and the InternationalBuilding Code. The use, storage and handling of hazardousmaterials in Group H-5 shall comply with this chapter, otherapplicable provisions of this code and the InternationalBuilding Application. The requirements set forth in this chap-ter are requirements specific only to Group H-5 and shall beapplied as exceptions or additions to applicable requirementsset forth elsewhere in this Multiple hazards. Where a material poses multiplehazards, all hazards shall be addressed in accordance withSection Existing buildings and existing FABRICATION buildings and existing FABRICATION areas shall com-ply with this chapter, except that transportation and handlingof HPM in corridors and enclosures for stairways and rampsshall be allowed when in compliance with Section the International Building Permits.
SEMICONDUCTOR FABRICATION FACILITIES 246 2014 OREGON FIRE CODE approved method of drainage or containment provided for connections if the material is a liquid. 2703.3 Construction requirements.
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