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SMT Process Guideline and Checklist

IPC-S-816 SMT Process Guidelineand ChecklistASSOCIATION CONNECTINGELECTRONICS INDUSTRIES2215 Sanders Road, Northbrook, IL 60062-6135 Tel. Fax standard developed by IPCO riginal PublicationJuly 1993 Table of , Safety, and IndustrialHygiene Considerations .. Documents .. Discharge (ESD) Concerns .. Leads .. Handling .. INSPECTION OF MATERIALSAND .. PASTE Printing .. Printing .. Condition: Wrong ComponentOrientation .. Condition: Wrong componentplaced on board .. Condition: Missing Component .. Condition: ComponentMisalignment .. Condition: Condition: No Reflow .. Condition: Solder Balls .. Condition: Charring of Board/Components .. Condition: DamagedComponents .. Condition: Cracked Joints.

SMT Process Guideline and Checklist 1.0 SCOPE This document is intended to provide guidelines and assis-tance in performing and troubleshooting the steps involved

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