Transcription of Solderability Tests for Printed Boards - IPC
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Solderability Tests for Printed Boards - IPC
IPC J-STD-003C-WAM1&2with Amendments1&2 SolderabilityTests forPrinted BoardsDeveloped by the Printed Circuit board Solderability Specifications Task Group (5-23a) of the Assembly and Joining Committee (5-20) of IPCU sers of this publication are encouraged to participate in the development of future :IPCS upersedes:J-STD-003C-WAM1 - May 2014J-STD-003C - September 2013J-STD-003B - March 2007J-STD-003A - February 2003J-STD-003 - April 1992 IPC-S-804A - January 1987 IPC-S-803 IPC-S-801 Table of .. of Requirements .. Hierarchy .. Method Classification .. Acceptance Criteria Tests .. Measurement Criteria Tests .. Method Selection .. Surface Finishes Not Covered in 6010or by 4500 Series Documents.
Solderability Tests for Printed Boards 1 GENERAL 1.1 Scope This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes (PTHs).
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