Transcription of SOT23 - NXP
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SOT23 - NXP
SOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm body9 January 2017 Package information1. Package summaryDimensions (mm) x x 1 Terminal position codeD (double)Package type descriptive codeTO-236 ABPackage outline version codeSOT23 Manufacturer package codeSOT23 Package type industry codeTO-236 ABPackage outline version descriptionplastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodyPackage style descriptive codeSOT (small outline transistor)Package body material typePJEDEC package outline codeTO-236 ABHandling precautionsIC26_CHAPTER_3_2000 Thermal design considerationsSC18_1999_CHAPTER_5_2 Mounting method typeS (surface mount)Generic mounting and soldering informationAN10365_3 Reflow soldering footprintSOT023_frWave soldering footprintSOT023_fwPackage life cycle statusRELM ajor version date18-9-2008 Minor version date6-7-2012 Security statusCOMPANY PUBLICM odifi
plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body 9 January 2017 Package information 1. Package summary Dimensions (mm) 2.9 x 1.3 x 1 Terminal position code D (double) Package type descriptive code TO-236AB Package outline version code SOT23 Manufacturer package code SOT23 Package type industry code TO-236AB
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