Transcription of SOT23 - NXP
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SOT23 - NXP
SOT23plastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm body9 January 2017 Package information1. Package summaryDimensions (mm) x x 1 Terminal position codeD (double)Package type descriptive codeTO-236 ABPackage outline version codeSOT23 Manufacturer package codeSOT23 Package type industry codeTO-236 ABPackage outline version descriptionplastic, surface-mounted package; 3 terminals; mm pitch; mm x mm x 1 mm bodyPackage style descriptive codeSOT (small outline transistor)Package body material typePJEDEC package outline codeTO-236 ABHandling precautionsIC26_CHAPTER_3_2000 Thermal design considerationsSC18_1999_CHAPTER_5_2 Mounting method typeS (surface mount)Generic mounting and soldering informationAN10365_3 Reflow soldering footprintSOT023_frWave soldering footprintSOT023_fwPackage life cycle statusRELM ajor version date18-9-2008 Minor version date6-7-2012 Security statusCOMPANY PUBLICM odified date28-11-2012 Issue date16-3-2006 Web publication date28-11-2012 Initial web publication date11-3-2011 Customer specific indicatorNMaturityProductPackage authorNair DeepaPackage approverNair DeepaTable 1.
IEC JEDEC JEITA SOT23 TO-236AB so t 0 2 3 _ p o 14-06-19 14-09-22 Plastic surface-mounted package; 3 leads SOT23 bp D A A1 Lp Q HE E 0 1 2 mm scale 1 2 c 3 B w B e e1 v A A X Unit mm max nom min 1.1 0.1 0.15 3.0 1.4 0.2 A Dimensions (mm are the original dimensions) A1 bp 0.48 c D E e e1 0.95 HE Lp Q v w 1.9 0.1 0.9 0.38 0.09 2.8 1.2 2.1 0.15 2 ...
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