Transcription of SS26 - Surface Mount Schottky Power Rectifier
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Semiconductor Components Industries, LLC, 2013 December, 2019 Rev. 71 Publication Order Number:SS26/DSurface MountSchottky Power RectifierSMB Power Surface Mount PackageSS26T3G, NRVBSS26T3G,NRVBSS26NT3G,SRVBSS26NT3G.. employing the Schottky Barrier principle in a metal to siliconpower Rectifier . Features epitaxial construction with oxide passivationand metal overlay contact. Ideally suited for low voltage, highfrequency switching Power supplies; free wheeling diodes andpolarity protection Compact Package with J Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Overvoltage Protection Low Forward Voltage Drop NRVB Prefix for Automotive and Other Applications RequiringUnique Site and Control Change Requirements; AEC Q101 Qualified and PPAP Capable* Pb Free Package is AvailableMechanical Characteristics: Case: Molded Epoxy Epoxy Meets UL 94, V O at in Weight: 95 mg (approximately) Cathode Polarity Band Lead and Mounting Surface Temperature for Soldering Purposes:260 C Max.
© Semiconductor Components Industries, LLC, 2013 June, 2017 − Rev. 6 1 Publication Order Number: SS26/D SS26T3G, NRVBSS26T3G Surface Mount Schottky Power Rectifier SMB Power Surface Mount Package
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