Transcription of Status of the Advanced Packaging Industry - Yole
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Status of the Advanced Packaging Industry - Yole
May 2015 Status of the Advanced Packaging Industry :2015 FROM TECHNOLOGIES TO MARKETA uthors: A. Ivankovic, T. Buisson, S. Kumar, A. Pizzagalliand R. BeicaSource: Nanium, StatsChipPACP ublication date: November 20152 TABLE OF CONTENTSoIntroduction, Definitions & Methodology oScope &ObjectivesoExecutive SummaryoMarket drivers Advanced Packaging drivers AP Market and Technology trendsoMarket forecasts overview Smartphone split by platform and teardowns Revenue forecast Wafer count forecast Unit count forecast IC type split per package type Wafer size split Capacity increase forecast 2015 | | Status of the Advanced Packaging IndustryoPlayersandSupplyChain Semiconductor Industry : overview Financial analysis M&A activity Market shares Company split by AP platformsoPackagingSegmentation Segmentationbydietoboardfeatures Packagefeaturetrends PricecomparisonoReflections and Case Studies / 3D adoption Latest products and announcements FO WLP adoption TSMC inFOanalysis eWLBlatest product FI WLP evolution Selected product Packaging for Internet of T
4 FEATURES OF THE 2015 REPORT Overview of Advanced Packaging trends, technology, production, market shares and financial insight The 1st Edition of the “Statusof the Advanced Packaging Industry”report from Yole Développement brings a thorough analysis,including:
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