Transcription of Stealth Dicing Technical Information for MEMS
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Stealth Dicing Technical Information for MEMS
Technical Stealth DicingInformationfor MEMS23" Stealth Dicing features" that will completely rewrite conventional Dicing conceptsProcessing methodWater (cooling / cleaning)ChippingDebris generationT-shape and round shape dicingHigh-speed ultra-thin wafer dicingChip yieldProcessing speedThermal effect on deviceGrinding cutting and processRequiredOccursGeneratesNot possibleMight be possible in certain casesNot so goodNot so goodAffected (including residual stress)* HAZ: Heat Affective ZoneSurface absorption laser process(melting, evaporation)RequiredOccursGeneratesPossi ble in certain casesPossible in certain casesNot so goodNot so goodAffected (HAZ*)Internal absorption laser process(locally selective)Not requiredDoes not occurDoes not generatePossiblePossibleGoodGoodNot affectedStealth dicingLaser dicingWafer dicingLaser ablation dici
3 "Stealth dicing features" that will completely rewrite conventional dicing concepts Processing method Water (cooling / cleaning) Chipping Debris generation
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