Transcription of SURFACE MOUNT NOMENCLATURE AND …
{{id}} {{{paragraph}}}
Example: tourism industry
SURFACE MOUNT NOMENCLATURE AND …
SURFACE MOUNTNOMENCLATUREAND PACKAGINGTel 800-776-9888 Email 4 MELF Tantalum .12 Transistors and 14 Lead 27 (Ball Grid Array)..36 Flip Pitch booklet is a plain-English introduction to SURFACE MOUNT nomenclatureand packaging. Soon you will be speaking the language of SURFACE Mountjust like a NomenclatureThere are many different types of SURFACE MOUNT packages. Each time anew SURFACE MOUNT package is developed a new name is created. Thesenames are usually abbreviated by their initials. As an example: The QuadFlat Pack is commonly known as the QFP. Unfortunately, some packageshave more than one name. This sometimes creates confusion in theindustry. I will do my best to explain the subtle dif ferences betweencomponent Package versus PackagingLet's start by clarifying the difference between the words "package(s)" and"packaging." The word "package" is used in this book to refer to thecomponent's physical shape or outline.
4 FLAT CHIP NOMENCLATURE Let's start out by studying simple flat chip components such as ceramic capacitors and resistors. The footprint (size) of flat chips is identified by a 4-digit size code.
Loading..
Tags:
Information
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
Related search queries
Surface Mount Multilayer Ceramic Chip Capacitors, Mount Multilayer Ceramic Chip Capacitors, Multilayer Ceramic Chip Capacitors, Mount, SURFACE-MOUNT CERAMIC MULTILAYER, Surface-Mount Ceramic Multilayer Capacitors, Ceramic capacitors, Multilayer ceramic capacitors, High Capacitance MLCCs, Multi-Layer Ceramic Capacitors, Multilayer Ceramic Capacitor